The temperature jump at an interface
In steady state a heat flux crosses the interface, and the temperatures on the two sides, extrapolated to the interface, differ by . The Wikipedia article on interfacial thermal resistance defines their ratio as the interface resistance; its inverse is the interface conductance . The article also says most phonon-mediated interfaces have conductances between 80 and 300 MW/(m² K).
An interface resistance acts like an extra slab of material. Converted into a thickness of the same material it is the Kapitza length, . Devices much larger than this can ignore the interface; at comparable sizes the interface becomes the main resistance.
Source: Wikipedia: Interfacial thermal resistance · Ioffe Institute
Acoustic mismatch: a perfectly flat interface
The acoustic mismatch model assumes a geometrically perfect interface that phonons cross elastically as waves in a continuum, with no scattering. Waves refract at the interface like light, following the law of refraction, and the transmitted fraction is set by the acoustic impedances on the two sides: the closer the impedances, the more gets through.
Going from a fast medium into a slow one, waves bend towards the normal and can always enter. Going from slow to fast, waves beyond the critical angle are totally reflected. The Lab’s packet tally samples every angle of incidence and should match the formula below within its error bars.
Diffuse mismatch: an interface that forgets
The diffuse mismatch model goes to the other extreme. The interface is fully rough, and a phonon reaching it scatters at random and forgets which side it came from. The chance of entering either side then depends only on how many states each side offers, not on the angle of incidence, and detailed balance fixes the number: in equilibrium the energy flows in the two directions must be equal.
For two gray Debye solids, the density of states times the speed at a given frequency is proportional to , which gives the formula below. Wikipedia says the elastic assumption makes acoustic-mismatch transmission lower, so the acoustic model typically gives an upper limit for the resistance and the diffuse model a lower limit. That is a rule of thumb, not a theorem: for the soft, heavy film in this chapter’s Lab the gray acoustic model gives 95.2 MW/(m² K), a little more conductance than the diffuse model’s 90.9.
Song and Chen tested the forgetting assumption with atomistic calculations and found that a single disordered interface does not make a phonon lose its memory completely, which limits where the diffuse mismatch model applies. Both models are textbook limits, not predictions for any real interface.
Source: Wikipedia: Interfacial thermal resistance · Q. Song and G. Chen
From transmission to conductance
Average the transmission over the incoming flux to get . The interface conductance is the ballistic bound of Chapter 2 times this average, with the heat capacity counting only the phonons that can enter the other side.
With transmission 1 the formula becomes , called the radiation limit. It is the same number as the ballistic bound between two black walls in Chapter 2.
Source: Wikipedia: Interfacial thermal resistance · Ioffe Institute
A jump between identical solids? Correcting the textbook formula
Make both sides the same material (the “Matched solids” preset). The transmission is 1 everywhere, the formula gives , and so there is still a jump. But there is no interface at all, so there should be no jump.
The question is what “temperature” means. The textbook formula compares the temperatures of the phonons heading into the interface: those moving right on the left side and those moving left on the right side. When heat flows, the phonon distribution in a diffusive region is itself lopsided, and phonons heading downstream are a little hotter than the local equilibrium. The first-order distribution of Chapter 2 shows that phonons heading into the interface are warmer than the local equilibrium temperature.
Subtracting this on both sides gives the interface resistance in terms of equilibrium temperatures (below), which is exactly zero for identical solids. This step is this course’s own derivation, based on the first-order approximation of Chapter 2, not taken from a reference. The extra wall resistance of 1 in the film of Chapter 3 is the same correction: the black-wall resistance minus on the film side, which for two walls adds up to 1 in units of the ballistic resistance. The exact solution gives about 1.06, so the first-order approximation is off by a few percent.
The Lab’s readouts still use the textbook formula, and its model notes say that identical solids keep the radiation-limit jump. That keeps the acoustic and diffuse mismatch values directly comparable with the literature.
Source: Wikipedia: Interfacial thermal resistance · A. A. Maznev
Worked example: silicon and a soft, heavy film
Problem: side 1 is gray silicon (sound speed 6351 m/s, density 2.329 g/cm³, Debye heat capacity at 300 K); side 2 is an assumed film with a sound speed of 2 km/s and a density of 11 g/cm³. With the diffuse mismatch model, find the conductance at 300 K, the Kapitza length, and the interface jump in a 1 µm stack with the interface in the middle and 10 K across it.
The Debye temperatures are 696 K and 219 K, and the impedances 14.79 and 22.00 MRayl. The diffuse transmission is . The film’s cutoff is low, and only silicon phonons below it can enter; their heat capacity is just , about 3.9% of the total.
So , inside the typical range Wikipedia gives and far below the radiation limit of 2545 MW/(m² K). The gray silicon conductivity is 128 W/(m K), so the Kapitza length is .
The stack carries , and the interface jump is , 44.4% of the total drop. With the corrected definition, , about 6% below , which does not change the conclusion.
Source: Wikipedia: Interfacial thermal resistance · Ioffe Institute · Q. Song and G. Chen